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iPhone 18的A20芯片将采用3nm工艺,支持Apple Intelligence升级

根据投资公司GF Securities分析师Jeff Pu的研究报告,iPhone 18系列将搭载基于台积电第三代3nm工艺(N3P)的A20芯片。该工艺与iPhone 17系列的A19和A19 Pro芯片相同,因此iPhone 18的整体性能提升可能相对有限。

不过,Pu预计A20芯片将采用台积电的CoWoS(Chip on Wafer on Substrate)封装技术,这将使芯片的处理器、统一内存和神经网络引擎更紧密地集成,从而提升Apple Intelligence的能力。

如果消息准确,台积电的2nm技术最早将在2027年应用于iPhone的A21芯片。

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iPhone 18的A20芯片将采用3nm工艺,支持Apple Intelligence升级

根据投资公司GF Securities分析师Jeff Pu的研究报告,iPhone 18系列将搭载基于台积电第三代3nm工艺(N3P)的A20芯片。该工艺与iPhone 17系列的A19和A19 Pro芯片相同,因此iPhone 18的整体性能提升可能相对有限。

不过,Pu预计A20芯片将采用台积电的CoWoS(Chip on Wafer on Substrate)封装技术,这将使芯片的处理器、统一内存和神经网络引擎更紧密地集成,从而提升Apple Intelligence的能力。

如果消息准确,台积电的2nm技术最早将在2027年应用于iPhone的A21芯片。

MacRumors

📮投稿 ☘️频道 🌸聊天

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However, analysts are positive on the stock now. “We have seen a huge downside movement in the stock due to the central electricity regulatory commission’s (CERC) order that seems to be negative from 2014-15 onwards but we cannot take a linear negative view on the stock and further downside movement on the stock is unlikely. Currently stock is underpriced. Investors can bet on it for a longer horizon," said Vivek Gupta, director research at CapitalVia Global Research.

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